Chip Model: TEC1-12705.
Dimensions: 40 * 40 * 3.8mm.
Component: Logarithm of 127.
Cooling Power: Qcmax 30W.
Assembly Pressure: 85N/cm2.

Storage Conditions: -40 ~ 60℃.
Rated Voltage: DC12V (Vmax: 15.5V).
Maximum Temperature: Tmax (Qc = 0) : 60℃.
Encapsulation Process: Standard 704 Silastic Seal.
Operating Current: Imax = 12 (rated voltage startup).
Wire Size: Lead Length 100 ± 5mm,RV standard wire,Single head 5mm Tin Plated.
Internal Resistance: 2.4 ~ 2.7Ω (ambient temperature 23 ± 1 , 1kHZ Ac test).
Working Environment: Temperature range -55℃ ~ 83℃ (high ambient temperature will directly affect the cooling efficiency).

Feature:
Solid state, vibration free, noise-free.
Simple to install and operate.
Should use with a heat sink.

Package Included:
5 x TEC1-12705 Heatsink Thermoelectric Cooler Cooling Peltier Plate Module

Product Features

• Chip Model: TEC1-12705.
• Storage conditions: -40 ~ 60℃.
• Rated voltage: DC12V (Vmax: 15.5V).
• Encapsulation Process: Standard 704 Silastic Seal.
• Internal resistance: 2.4 ~ 2.7Ω (ambient temperature 23 ± 1 ℃, 1kHZ Ac test).